Directly growing 2D and 1D materials on silicon substrates is typically challenging due to their weak interaction with the silicon surface. These 1D/2D materials are often synthesized on alternative substrates such as sapphire or metal foils at elevated temperatures. To integrate them into silicon wafers, a transfer process for these atomically thin materials is essential, though technically demanding. For 1D materials like carbon nanotubes, the precise assembly of individual nanotubes onto wafers remains a critical challenge for practical device applications.